A FEM/VOF hybrid formulation for underfill encapsulation modeling
Author(s): |
Daniel Pantuso
Lei Jiang Sadasivan Shankar Sergei Skokov |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Computers & Structures, May 2003, n. 8-11, v. 81 |
Page(s): | 879-885 |
DOI: | 10.1016/s0045-7949(02)00419-4 |
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05/01/2019 - Last updated on:
05/01/2019