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Fatigue crack propagation properties of submicron-thick freestanding copper films in vacuum environment

Author(s):



Medium: journal article
Language(s): English
Published in: Procedia Structural Integrity, , v. 2
Page(s): 1359-1366
DOI: 10.1016/j.prostr.2016.06.173
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.prostr.2016.06.173.
  • About this
    data sheet
  • Reference-ID
    10641651
  • Published on:
    17/02/2022
  • Last updated on:
    17/02/2022
 
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