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The evolution of intragranular microcracks caused by interface migration induced by electromigration

Author(s):

Medium: journal article
Language(s): English
Published in: Journal of Mechanics of Materials and Structures, , n. 4, v. 16
Page(s): 487-500
DOI: 10.2140/jomms.2021.16.487
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.2140/jomms.2021.16.487.
  • About this
    data sheet
  • Reference-ID
    10639957
  • Published on:
    30/11/2021
  • Last updated on:
    30/11/2021
 
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