0
  • DE
  • EN
  • FR
  • International Database and Gallery of Structures

Advertisement

Enhancement of the thermal conductivity of adhesives for wood flooring using xGnP

Author(s):


Medium: journal article
Language(s): English
Published in: Energy and Buildings, , v. 51
Page(s): 153-156
DOI: 10.1016/j.enbuild.2012.05.003
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.enbuild.2012.05.003.
  • About this
    data sheet
  • Reference-ID
    10466459
  • Published on:
    27/10/2020
  • Last updated on:
    27/10/2020
 
Structurae cooperates with
International Association for Bridge and Structural Engineering (IABSE)
e-mosty Magazine
e-BrIM Magazine