An Electromechanical Impedance-Based Imaging Algorithm for Damage Identification of Chemical Milling Stiffened Panel
Author(s): |
Xie Jiang
Wensong Zhou Xize Chen Xin Zhang Jiefeng Xie Tao Tang Yuxiang Zhang Zhengwei Yang |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Structural Control and Health Monitoring, January 2024, v. 2024 |
Page(s): | 1-15 |
DOI: | 10.1155/2024/4554472 |
- About this
data sheet - Reference-ID
10784497 - Published on:
20/06/2024 - Last updated on:
20/06/2024