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An efficient localized Trefftz-based collocation scheme for heat conduction analysis in two kinds of heterogeneous materials under temperature loading

Author(s):



Medium: journal article
Language(s): English
Published in: Computers & Structures, , v. 255
Page(s): 106619
DOI: 10.1016/j.compstruc.2021.106619
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruc.2021.106619.
  • About this
    data sheet
  • Reference-ID
    10625267
  • Published on:
    26/08/2021
  • Last updated on:
    26/08/2021
 
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