Effects of adhesive thickness on the Lamb wave pitch-catch signal using bonded piezoelectric wafer transducers
| Author(s): |
M. M. Islam
H. Huang |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Smart Materials and Structures, August 2016, n. 8, v. 25 |
| Page(s): | 085014 |
| DOI: | 10.1088/0964-1726/25/8/085014 |
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10226369 - Published on:
04/12/2018 - Last updated on:
04/12/2018
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