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Effect of microwave-assisted curing on bamboo glue strength: Bonded by thermosetting phenolic resin

Author(s):



Medium: journal article
Language(s): English
Published in: Construction and Building Materials, , v. 68
Page(s): 320-325
DOI: 10.1016/j.conbuildmat.2014.07.014
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.conbuildmat.2014.07.014.
  • About this
    data sheet
  • Reference-ID
    10243241
  • Published on:
    15/12/2018
  • Last updated on:
    15/12/2018
 
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