Effect of cracks on thermal stress and strain of a tape automated bonded package
| Author(s): |
C. M. L. Wu
J. K. L. Lai Yongli Wu |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Composite Structures, 1997, n. 1-4, v. 38 |
| Page(s): | 525-530 |
| DOI: | 10.1016/s0263-8223(97)00088-3 |
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10460102 - Published on:
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25/10/2020
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