Dynamic thermal performance and energy-saving potential analysis of a modular pipe-embedded building envelope integrated with thermal diffusive materials
Author(s): |
Yang Yang
Sarula Chen |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Building Simulation, September 2023, n. 12, v. 16 |
Page(s): | 2285-2305 |
DOI: | 10.1007/s12273-023-1039-8 |
- About this
data sheet - Reference-ID
10745522 - Published on:
28/10/2023 - Last updated on:
14/01/2024