Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect
| Author(s): |
Mengyuan He
Hong Liu Lianggen Shao Baizhan Li Yuxin Wu |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Building Simulation, 13 July 2024, n. 8, v. 17 |
| Page(s): | 1253-1271 |
| DOI: | 10.1007/s12273-024-1139-0 |
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data sheet - Reference-ID
10797253 - Published on:
01/09/2024 - Last updated on:
01/09/2024
Structurae cooperates with
