Disbond detection with piezoelectric wafer active sensors in RC structures strengthened with FRP composite overlays
Author(s): |
Victor Giurgiutiu
Kent Harries Michael Petrou Joel Bost Josh B. Quattlebaum |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Earthquake Engineering and Engineering Vibration, December 2003, n. 2, v. 2 |
Page(s): | 213-223 |
DOI: | 10.1007/s11803-003-0005-9 |
- About this
data sheet - Reference-ID
10322535 - Published on:
12/07/2019 - Last updated on:
12/07/2019