A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures
Author(s): |
Yanpeng Gong
Yida He Han Hu Xiaoying Zhuang Fei Qin Hao Xu Timon Rabczuk |
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Medium: | journal article |
Language(s): | English |
Published in: | Engineering Structures, March 2025, v. 326 |
Page(s): | 119500 |
DOI: | 10.1016/j.engstruct.2024.119500 |
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10807876 - Published on:
07/01/2025 - Last updated on:
07/01/2025