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Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

Author(s):


Medium: journal article
Language(s): English
Published in: Frattura ed Integrità Strutturale, , n. 51, v. 14
Page(s): 541-551
DOI: 10.3221/igf-esis.51.41
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.3221/igf-esis.51.41.
  • About this
    data sheet
  • Reference-ID
    10457333
  • Published on:
    24/10/2020
  • Last updated on:
    24/10/2020
 
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