Adhesive Contact between a Rigid Punch and a Half-Plane via a Thin, Soft Interlayer
Author(s): |
M. I. Porter
D. A. Hills |
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Medium: | journal article |
Language(s): | English |
Published in: | Journal of Engineering Mechanics (ASCE), February 2001, n. 2, v. 127 |
Page(s): | 176-179 |
DOI: | 10.1061/(asce)0733-9399(2001)127:2(176) |
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10349017 - Published on:
14/08/2019 - Last updated on:
14/08/2019