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3D printed epoxy composite microsandwich with high strength, toughness, and EMI shielding performances

Author(s): ORCID








Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 323
Page(s): 117456
DOI: 10.1016/j.compstruct.2023.117456
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2023.117456.
  • About this
    data sheet
  • Reference-ID
    10738664
  • Published on:
    03/09/2023
  • Last updated on:
    03/09/2023
 
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