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Utilization of micro copper slag in SCC subjected to high temperature

Author(s):

Medium: journal article
Language(s): English
Published in: Journal of Building Engineering, , v. 29
Page(s): 101128
DOI: 10.1016/j.jobe.2019.101128
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.jobe.2019.101128.
  • About this
    data sheet
  • Reference-ID
    10403685
  • Published on:
    28/12/2019
  • Last updated on:
    28/12/2019
 
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