Thermodynamic performance of SiC-enhanced MicroPCM backfill based on response surface methodology
Author(s): |
Ya Yin
Lan Qiao Qingwen Li Lu Chen Miao Miao Jinshui Dong Linbo Song An Luo Haiqi Zheng |
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Medium: | journal article |
Language(s): | English |
Published in: | Case Studies in Construction Materials, July 2024, v. 20 |
Page(s): | e03345 |
DOI: | 10.1016/j.cscm.2024.e03345 |
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10789601 - Published on:
20/06/2024 - Last updated on:
20/06/2024