Thermally activated wall panels with microencapsulated PCM: comparison of 1D and 3D models
| Author(s): |
L. Klimeš
P. Charvát M. Ostrý |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Journal of Building Performance Simulation, January 2019, n. 4, v. 12 |
| Page(s): | 404-419 |
| DOI: | 10.1080/19401493.2018.1543350 |
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10547529 - Published on:
20/01/2021 - Last updated on:
19/02/2021
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