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Thermal performance study of PCM embedded radiant cooling ceiling assisted by infrared-transparent silicon wafers

Author(s):




Medium: journal article
Language(s): English
Published in: Energy and Buildings, , v. 321
Page(s): 114644
DOI: 10.1016/j.enbuild.2024.114644
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.enbuild.2024.114644.
  • About this
    data sheet
  • Reference-ID
    10796098
  • Published on:
    01/09/2024
  • Last updated on:
    01/09/2024
 
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