0
  • DE
  • EN
  • FR
  • International Database and Gallery of Structures

Advertisement

Thermal conductivities of plain woven C/SiC composite: Micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids

Author(s):


Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 193
Page(s): 212-223
DOI: 10.1016/j.compstruct.2018.03.030
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2018.03.030.
  • About this
    data sheet
  • Reference-ID
    10450643
  • Published on:
    23/10/2020
  • Last updated on:
    23/10/2020
 
Structurae cooperates with
International Association for Bridge and Structural Engineering (IABSE)
e-mosty Magazine
e-BrIM Magazine