Study on curing degree of emulsified asphalt chip seal based on the comprehensive electrical properties index
| Author(s): |
Qingwei Zeng
Yang Zhang
Shunxin Yang
Feng Xiao
Dongxing Luan Qixuan Cui |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Construction and Building Materials, March 2024, v. 418 |
| Page(s): | 135401 |
| DOI: | 10.1016/j.conbuildmat.2024.135401 |
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10772016 - Published on:
29/04/2024 - Last updated on:
29/04/2024
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