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Soil conditioning of clay based on interface adhesion mechanism: Microscopic simulation and laboratory experiment

Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.undsp.2023.12.007.
  • About this
    data sheet
  • Reference-ID
    10785264
  • Published on:
    20/06/2024
  • Last updated on:
    20/06/2024
 
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