Simulating the warping of thin coated Si wafers using Ansys layered shell elements
Author(s): |
J. Schicker
W. A. Khan T. Arnold C. Hirschl |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Composite Structures, April 2016, v. 140 |
Page(s): | 668-674 |
DOI: | 10.1016/j.compstruct.2015.12.062 |
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10453064 - Published on:
23/10/2020 - Last updated on:
23/10/2020