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Simulating the warping of thin coated Si wafers using Ansys layered shell elements

Author(s):



Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 140
Page(s): 668-674
DOI: 10.1016/j.compstruct.2015.12.062
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2015.12.062.
  • About this
    data sheet
  • Reference-ID
    10453064
  • Published on:
    23/10/2020
  • Last updated on:
    23/10/2020
 
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