Piezoelectric-based monitoring of the curing of structural adhesives: a novel experimental study
Author(s): |
Yee Yan Lim
Zi Sheng Tang Scott T. Smith |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Smart Materials and Structures, January 2019, n. 1, v. 28 |
Page(s): | 015016 |
DOI: | 10.1088/1361-665x/aaeea4 |
- About this
data sheet - Reference-ID
10222770 - Published on:
01/12/2018 - Last updated on:
01/12/2018