Modular analysis of assemblages of three-dimensional structures with unilateral contact conditions
Author(s): |
L. Champaney
J. Y. Cognard P. Ladevèze |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Computers & Structures, October 1999, n. 1-5, v. 73 |
Page(s): | 249-266 |
DOI: | 10.1016/s0045-7949(98)00285-5 |
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10280310 - Published on:
05/01/2019 - Last updated on:
05/01/2019