Modified electromechanical impedance-based disbond monitoring for honeycomb sandwich composite structure
Author(s): |
Jianjian Zhu
Yishou Wang Xinlin Qing |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Composite Structures, June 2019, v. 217 |
Page(s): | 175-185 |
DOI: | 10.1016/j.compstruct.2019.03.033 |
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10449300 - Published on:
23/10/2020 - Last updated on:
23/10/2020