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Modified electromechanical impedance-based disbond monitoring for honeycomb sandwich composite structure

Author(s):


Medium: journal article
Language(s): English
Published in: Composite Structures, , v. 217
Page(s): 175-185
DOI: 10.1016/j.compstruct.2019.03.033
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.compstruct.2019.03.033.
  • About this
    data sheet
  • Reference-ID
    10449300
  • Published on:
    23/10/2020
  • Last updated on:
    23/10/2020
 
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