Modeling Temperature-Dependent Behavior of Soft Clay
Author(s): |
L. Z. Wang
K. J. Wang Y. Hong |
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Medium: | journal article |
Language(s): | English |
Published in: | Journal of Engineering Mechanics (ASCE), August 2016, n. 8, v. 142 |
Page(s): | 04016054 |
DOI: | 10.1061/(asce)em.1943-7889.0001108 |
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10346632 - Published on:
14/08/2019 - Last updated on:
14/08/2019