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Modeling of Transient Conduction in Building Envelope Assemblies: A Review

Author(s): (Pacific Northwest National Laboratory, Richland, WA, USA;)
(Georgia Institute of Technology, Atlanta, GA, USA)
Medium: journal article
Language(s): English
Published in: Science and Technology for the Built Environment, , n. 6, v. 28
Page(s): 1-20
DOI: 10.1080/23744731.2022.2068315
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1080/23744731.2022.2068315.
  • About this
    data sheet
  • Reference-ID
    10665153
  • Published on:
    09/05/2022
  • Last updated on:
    13/08/2022
 
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