Modeling of Transient Conduction in Building Envelope Assemblies: A Review
| Author(s): |
Tyler Pilet
(Pacific Northwest National Laboratory, Richland, WA, USA;)
Tarek Rakha (Georgia Institute of Technology, Atlanta, GA, USA) |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Science and Technology for the Built Environment, 3 July 2022, n. 6, v. 28 |
| Page(s): | 1-20 |
| DOI: | 10.1080/23744731.2022.2068315 |
- About this
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10665153 - Published on:
09/05/2022 - Last updated on:
13/08/2022
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