A mechanical model for direct wafer bonding by strain energy under normal pressure
| Author(s): |
Shirong Cai
Yunyun Sun Shijing Wu Henry Tan |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Journal of Mechanics of Materials and Structures, 29 January 2025, n. 1, v. 20 |
| Page(s): | 1-14 |
| DOI: | 10.2140/jomms.2025.20.1 |
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data sheet - Reference-ID
10816423 - Published on:
03/02/2025 - Last updated on:
03/02/2025
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