Lumped parameter thermal analysis of multilayered composite pipe with MicroPCM particles
Author(s): |
Hui Wang
Menglan Duan Chen An Jian Su |
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Medium: | journal article |
Language(s): | English |
Published in: | Composite Structures, March 2021, v. 260 |
Page(s): | 113495 |
DOI: | 10.1016/j.compstruct.2020.113495 |
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10543044 - Published on:
12/01/2021 - Last updated on:
19/02/2021