Investigation on packaging parameters of a circular multi-layered diaphragm-type piezoelectric actuator
Author(s): |
Samuel I. En Lin
|
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Computers & Structures, February 2011, n. 3-4, v. 89 |
Page(s): | 371-379 |
DOI: | 10.1016/j.compstruc.2010.11.007 |
- About this
data sheet - Reference-ID
10273368 - Published on:
05/01/2019 - Last updated on:
05/01/2019