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Extended displacement discontinuity method for analysis of cracks in 2D thermal piezoelectric semiconductors

Author(s):



Medium: journal article
Language(s): English
Published in: Smart Materials and Structures, , n. 8, v. 26
Page(s): 085029
DOI: 10.1088/1361-665x/aa754d
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1088/1361-665x/aa754d.
  • About this
    data sheet
  • Reference-ID
    10215273
  • Published on:
    04/12/2018
  • Last updated on:
    04/12/2018
 
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