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Experimental Study of a Bond-Slip Model of CFRP Bonding Adhesive after Exposure to High Temperature

Author(s):

ORCID


Medium: journal article
Language(s): English
Published in: Iranian Journal of Science and Technology, Transactions of Civil Engineering, , n. 6, v. 47
Page(s): 3375-3383
DOI: 10.1007/s40996-023-01130-w
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1007/s40996-023-01130-w.
  • About this
    data sheet
  • Reference-ID
    10732567
  • Published on:
    04/08/2023
  • Last updated on:
    14/01/2024
 
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