Experimental investigation of thermal performance of microencapsulated PCM-contained wallboard by two measurement modes
Author(s): |
Chaoen Li
Hang Yu Yuan Song |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Energy and Buildings, February 2019, v. 184 |
Page(s): | 34-43 |
DOI: | 10.1016/j.enbuild.2018.11.032 |
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10473016 - Published on:
27/10/2020 - Last updated on:
27/10/2020