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Experimental determination of strain distribution on Printed Circuit Boards using Digital image correlation

Author(s):


Medium: journal article
Language(s): English
Published in: Procedia Structural Integrity, , v. 18
Page(s): 214-222
DOI: 10.1016/j.prostr.2019.08.156
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.prostr.2019.08.156.
  • About this
    data sheet
  • Reference-ID
    10644988
  • Published on:
    10/01/2022
  • Last updated on:
    10/01/2022
 
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