An electromechanical impedance model of a piezoceramic transducer-structure in the presence of thick adhesive bonding
| Author(s): |
Annamdas Venu Gopal Madhav
Chee Kiong Soh |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Smart Materials and Structures, June 2007, n. 3, v. 16 |
| Page(s): | 673-686 |
| DOI: | 10.1088/0964-1726/16/3/014 |
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10223436 - Published on:
04/12/2018 - Last updated on:
04/12/2018
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