Direct ink writing of 3D conductive polyaniline structures and rheological modelling
Author(s): |
F. Benjamin Holness
Aaron D. Price |
---|---|
Medium: | journal article |
Language(s): | English |
Published in: | Smart Materials and Structures, January 2018, n. 1, v. 27 |
Page(s): | 015006 |
DOI: | 10.1088/1361-665x/aa981c |
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10214771 - Published on:
04/12/2018 - Last updated on:
04/12/2018