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Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills

Author(s):



Medium: journal article
Language(s): English
Published in: Construction and Building Materials, , v. 360
Page(s): 129601
DOI: 10.1016/j.conbuildmat.2022.129601
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.conbuildmat.2022.129601.
  • About this
    data sheet
  • Reference-ID
    10698712
  • Published on:
    10/12/2022
  • Last updated on:
    10/12/2022
 
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