Adhesion Quality of Chip Seals: Comparing and Correlating the Plate-Stripping Test, Boiling-Water Test, and Energy Parameters from Surface Free Energy
| Author(s): |
Allex E. Alvarez
Leidy V. Espinosa Asmirian M. Perea Oscar J. Reyes Ivan J. Paba |
|---|---|
| Medium: | journal article |
| Language(s): | English |
| Published in: | Journal of Materials in Civil Engineering (ASCE), March 2019, n. 3, v. 31 |
| Page(s): | 04018401 |
| DOI: | 10.1061/(asce)mt.1943-5533.0002603 |
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data sheet - Reference-ID
10275294 - Published on:
06/01/2019 - Last updated on:
06/01/2019
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