Adhesion Quality of Chip Seals: Comparing and Correlating the Plate-Stripping Test, Boiling-Water Test, and Energy Parameters from Surface Free Energy
Auteur(s): |
Allex E. Alvarez
Leidy V. Espinosa Asmirian M. Perea Oscar J. Reyes Ivan J. Paba |
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Médium: | article de revue |
Langue(s): | anglais |
Publié dans: | Journal of Materials in Civil Engineering (ASCE), mars 2019, n. 3, v. 31 |
Page(s): | 04018401 |
DOI: | 10.1061/(asce)mt.1943-5533.0002603 |
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sur cette fiche - Reference-ID
10275294 - Publié(e) le:
06.01.2019 - Modifié(e) le:
06.01.2019