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Automatic integrated system for monitoring superficial cracks

Author(s): ORCID

ORCID

Medium: conference paper
Language(s): English
Conference: 35th Annual Symposium of IABSE / 52nd Annual Symposium of IASS / 6th International Conference on Space Structures: Taller, Longer, Lighter - Meeting growing demand with limited resources, London, United Kingdom, September 2011
Published in:
Year: 2011
Abstract:

The authors have been studying the use of image processing techniques to monitor cracking in quasi-brittle materials during laboratorial tests. So far, the presence of discontinuities in the image other than cracks, e.g. surface imperfections, has prevented the complete automation of the method, thus requiring the intervention of the user. To overcome this drawback, an integrated approach is herein proposed, using both the displacement field obtained by photogrammetry and image processing.

Direct shear tests (DST) were used to test and validate the new method. Critical areas were automatically identified and the corresponding crack pattern characterised from the start until the complete failure of the specimens. It is stressed out that with this method all stored data is easily processed and analysed. The crack pattern and all related measures (e.g. crack length, area or path) can be provided at any stage.

Keywords:
image processing monitoring Laboratorial tests Crack characterization
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  • About this
    data sheet
  • Reference-ID
    10065297
  • Published on:
    03/10/2011
  • Last updated on:
    05/07/2021
 
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