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Untersuchungen zu Wärmeleitfähigkeit und Feuchteverhalten von Holzfaserplatten und Materialkombinationen

Author(s):



Medium: journal article
Language(s): German
Published in: Bauphysik, , n. 4, v. 34
Page(s): 157-169
DOI: 10.1002/bapi.201200020
Abstract:

Investigation of thermal conductivity and moisture behaviour of fibreboard and material combinations.

In the presented paper relevant thermal and hygroscopic parameters of wood fiberboards were determined. The investigations were conducted on up to date products in a single state or in combination. Furthermore materials based on hemp and mineral fibers were included in the investigations. The determination of the thermal conductivity, the sorption behavior, swelling and shrinkage was done in accordance to the actual standards. Concerning the thermal behavior a correlation between density and thermal conductivity was obvious, but different significant for the several density groups. For the material combination the density of the outer layers dominates the thermal parameters, respectively at this position light material leads to low thermal conductivity. The vapor diffusion gets influence by the production process of the single materials. The thickness of the boards tends to influence the vapor resistance as well. The sorption curves for de- and adsorption show the expected hysteresis like for solid wood. But the sorption speed varies clearly for the different materials. The swelling perpendicular to the panel plane is significant higher than in plane. The production direction has a little influence in the swelling behavior only.

Keywords:
measurements heat conductivity thermal conductivity adhesion film dry cup glue layer shrinkage value swelling value water vapour diffusion resistance wet cup method dry-cup procedure
Available from: Refer to publisher
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1002/bapi.201200020.
  • About this
    data sheet
  • Reference-ID
    10066736
  • Published on:
    05/09/2012
  • Last updated on:
    13/08/2014
 
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