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Understanding the effects of adhesive layer on the electromechanical impedance (EMI) of bonded piezoelectric wafer transducer

Author(s):

Medium: journal article
Language(s): English
Published in: Smart Materials and Structures, , n. 12, v. 23
Page(s): 125037
DOI: 10.1088/0964-1726/23/12/125037
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1088/0964-1726/23/12/125037.
  • About this
    data sheet
  • Reference-ID
    10225704
  • Published on:
    04/12/2018
  • Last updated on:
    04/12/2018
 
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