0
  • DE
  • EN
  • FR
  • International Database and Gallery of Structures

Advertisement

Transient heat conduction problems using B.I.E.M.

Author(s):

Medium: journal article
Language(s): English
Published in: Computers & Structures, , n. 6, v. 16
Page(s): 717-730
DOI: 10.1016/0045-7949(83)90063-9
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/0045-7949(83)90063-9.
  • About this
    data sheet
  • Reference-ID
    10272511
  • Published on:
    05/01/2019
  • Last updated on:
    05/01/2019
 
Structurae cooperates with
International Association for Bridge and Structural Engineering (IABSE)
e-mosty Magazine
e-BrIM Magazine