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Study on the Performance of Active Embedded Steel Wire Knot Form in Silicone Graphene Composite Thermal Insulation Structure Integrated System

Author(s):

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Medium: journal article
Language(s): English
Published in: Buildings, , n. 3, v. 13
Page(s): 705
DOI: 10.3390/buildings13030705
Abstract:

Based on the advantages of the silicone graphene composite thermal insulation board, it was used to replace traditional plywood in the external wall formwork system, and the active embedded steel wire knot form in silicone graphene composite thermal insulation structure integrated system was designed. Firstly, the theoretical model of steel wire drawing resistance was established by theoretical analysis method, and the rationality of the theoretical model was verified by combining relevant experimental data. The relationship between multiple variables and steel wire pull-out resistance was analyzed. Then, combined with the theory of wind pressure strength of the exterior wall of a building structure, the layout form and the corresponding number of embedded steel wires of thermal insulation board under different building heights were analyzed. Finally, the silicone graphene composite thermal insulation board and ordinary plywood were compared and analyzed from the force of perspective of external wall formwork. The results showed that the pull-out resistance of steel wire was directly proportional to the diameter of steel wire, embedded depth, and embedded deflection angle. With the increase of building height, the number of steel wires to be arranged also increased. When the thickness of the silicone graphene composite thermal insulation board is not less than 80 mm, the anti-deformation effect is close to that of the ordinary plywood, which can meet the construction requirements of the external wall formwork. It can ensure the energy conservation and thermal insulation of the external wall, integrate the building’s exterior wall and thermal insulation structure of the building, and achieve the purpose of exemption from formwork removal.

Copyright: © 2023 by the authors; licensee MDPI, Basel, Switzerland.
License:

This creative work has been published under the Creative Commons Attribution 4.0 International (CC-BY 4.0) license which allows copying, and redistribution as well as adaptation of the original work provided appropriate credit is given to the original author and the conditions of the license are met.

  • About this
    data sheet
  • Reference-ID
    10712339
  • Published on:
    21/03/2023
  • Last updated on:
    10/05/2023
 
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