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Sandwich Composite Panel from Spent Mushroom Substrate Fiber and Empty Fruit Bunch Fiber for Potential Green Thermal Insulation

Author(s):
ORCID
ORCID

ORCID
ORCID
ORCID
Medium: journal article
Language(s): English
Published in: Buildings, , n. 1, v. 13
Page(s): 224
DOI: 10.3390/buildings13010224
Abstract:

Massive generation of natural waste fiber from agricultural industries followed by improper disposal management might result in a detrimental effect on our ecosystem contributing to various types of environmental pollution. With the growing significance of climate change, an effort is being undertaken by utilizing natural waste fiber into eco-friendly insulation panels to reduce the environmental impact of buildings. In this research, a composite panel was developed from spent mushroom substrate (SMS) and empty fruit bunch (EFB) fibers via a sandwich technique. Five samples were made, each with a different fiber ratio (100 SMS: 0 EFB, 80 SMS: 20 EFB, 60 SMS: 40 EFB, 40 SMS: 60 EFB, and 0 SMS: 100 EFB) at density 0.8 g/cm³. Fourier transformation infrared (FTIR) Soxhlet extraction followed by thermogravimetric analysis (TGA) indicated that the SMS and EFB fibers were relevant for fabrication into a composite panel for thermal insulation. Thermal conductivity, thermal resistance, and thermal diffusivity values for these five composite samples were 0.231 to 0.31 W/(mK), 0.0194 to 0.0260 m²K/W, and 0.2665 to 0.3855 mm²/s, respectively. The flexural strength of the composite was at the range 15.61 to 23.62 MPa. These research findings suggest that the fabrication of a sandwich composite panel from SMS and EFB fiber is a promising alternative way to utilize natural waste fiber.

Copyright: © 2023 by the authors; licensee MDPI, Basel, Switzerland.
License:

This creative work has been published under the Creative Commons Attribution 4.0 International (CC-BY 4.0) license which allows copying, and redistribution as well as adaptation of the original work provided appropriate credit is given to the original author and the conditions of the license are met.

  • About this
    data sheet
  • Reference-ID
    10712449
  • Published on:
    21/03/2023
  • Last updated on:
    10/05/2023
 
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