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A review of research on dynamic thermal comfort

Author(s): ORCID (School of Environment and Architecture, University of Shanghai for Science and Technology, Shanghai, China)
(School of Environment and Architecture, University of Shanghai for Science and Technology, Shanghai, China)
(School of Environment and Architecture, University of Shanghai for Science and Technology, Shanghai, China)
(School of Environment and Architecture, University of Shanghai for Science and Technology, Shanghai, China)
Medium: journal article
Language(s): English
Published in: Building Services Engineering Research and Technology, , n. 4, v. 42
Page(s): 014362442110030
DOI: 10.1177/01436244211003028
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1177/01436244211003028.
  • About this
    data sheet
  • Reference-ID
    10603262
  • Published on:
    17/04/2021
  • Last updated on:
    29/06/2021
 
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