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Numerical modeling of the thermal performance of soil containing microencapsulated PCM

Author(s):


Medium: journal article
Language(s): English
Published in: Construction and Building Materials, , v. 298
Page(s): 123865
DOI: 10.1016/j.conbuildmat.2021.123865
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1016/j.conbuildmat.2021.123865.
  • About this
    data sheet
  • Reference-ID
    10628607
  • Published on:
    02/09/2021
  • Last updated on:
    02/09/2021
 
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