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Kinetics of Thermal and Oxidative Decomposition of Printed Circuit Boards

Author(s):



Medium: journal article
Language(s): English
Published in: Journal of Environmental Engineering (ASCE), , n. 3, v. 125
Page(s): 277-283
DOI: 10.1061/(asce)0733-9372(1999)125:3(277)
Structurae cannot make the full text of this publication available at this time. The full text can be accessed through the publisher via the DOI: 10.1061/(asce)0733-9372(1999)125:3(277).
  • About this
    data sheet
  • Reference-ID
    10582871
  • Published on:
    08/03/2021
  • Last updated on:
    08/03/2021
 
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